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Case Lawsuit Title
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Case / Trial ID Number
Jurisdiction Code
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us
in
upc
eu
Category
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Patent
Trademark
Copyright
Design
Filing Date
Decision Verdict Date
Court / Tribunal
Bench / Panel Judges
Petitioner / Claimant (Plaintiff)
Texas Instruments Incorporated
Respondent / Defendant
Bell Semiconductor, LLC
Dispute Summary
Texas Instruments Incorporated filed an IPR challenging 12 claims of a Bell Semiconductor LLC patent related to Ball Grid Array (BGA) packaging reliability. The petitioner asserts that all claims are unpatentable over prior art by demonstrating predictable modifications using combinations of known semiconductor package designs and stress mitigation techniques.
Outcome / Ruling
null
Verdict Document PDF URL
Full text judgment
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